Copy of Materials | NanoVoxel

PARTNERSHIP WITH THE TOP PLAYER INDUSTRIES

NanoVoxel shapes every material to bring your vision to life

We use a wide variety of materials to meet specific technical requirements, such as biocompatibility, transparency, stiffness, melting temperature, and durability.

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EXTENDED MATERIAL OPTIONS

We don’t go for typical.

We go for everything.

We address the different stages of the production process. In this context, we adapt both budget and materials, transitioning from ultra-resolution photoresins to ceramics, TPE, glass, and epoxies, while appropriately modifying production procedures to ensure the highest quality and performance of the final product.

PHOTOPOLYMERS

STANDARD HIGH-RES PHOTORESIN
Elastic module:
Melting temperature:
Refractive index at 589 nm:
Medium to high stiffness

We can choose trasparent or non-trasparent materials.

THERMO-SETS

EPOXY
Elastic module:
Molded temperature:
Melting temperature:
Medium to high stiffness

SILICON
Elastic module:
Molded temperature:
Melting temperature:
Medium to high stiffness

THERMOPLASTICS

TPE
Elasticity: 300%–600%;Processing temperature: 180°C–250°C (356°F–482°F);Fatigue tesistance: 100,000–500,000 cycles;UV resistance: ModerateTensile strength: 5–50 MPa.

GLASS PARTS

STANDARD HIGH-RES PHOTORESIN
Elastic module:
Melting temperature:
Refractive index at 589 nm:
Medium to high stiffness

We can choose trasparent or non-trasparent materials.

METALS

STANDARD HIGH-RES PHOTORESIN
Elastic module:
Melting temperature:
Refractive index at 589 nm:
Medium to high stiffness

We can choose trasparent or non-trasparent materials.

OTHER MATERIALS

We can support you in achieving performances and functionality. If you have a specific material in mind do not hesitate to send us a customized request.

MATERIALS FOR PHARMA AND MEDICAL APPLICATIONS

Project favorites

In the need of inspiration for the materials you can use for your production? Check the most quoted proposals.

HIGH-RES PHOTORESIN

EPOXY

POM

PEEK

GLASS

TPE

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STANDARD HIGH-RES PHOTORESIN Elastic module: Melting temperature: Refractive index at 589 nm: Medium to high stiffness We can choose trasparent or non-trasparent materials.

EPOXY Elastic module: Molded temperature: Melting temperature: Medium to high stiffness SILICON Elastic module: Molded temperature: Melting temperature: Medium to high stiffness

TPE Elasticity: 300%–600%;Processing temperature: 180°C–250°C (356°F–482°F);Fatigue tesistance: 100,000–500,000 cycles;UV resistance: ModerateTensile strength: 5–50 MPa.

STANDARD HIGH-RES PHOTORESIN Elastic module: Melting temperature: Refractive index at 589 nm: Medium to high stiffness We can choose trasparent or non-trasparent materials.

STANDARD HIGH-RES PHOTORESIN Elastic module: Melting temperature: Refractive index at 589 nm: Medium to high stiffness We can choose trasparent or non-trasparent materials.

We can support you in achieving performances and functionality. If you have a specific material in mind do not hesitate to send us a customized request.

In the need of inspiration for the materials you can use for your production? Check the most quoted proposals.

STANDARD HIGH-RES PHOTORESIN
Elastic module:
Melting temperature:
Refractive index at 589 nm:
Medium to high stiffness

We can choose trasparent or non-trasparent materials.

EPOXY
Elastic module:
Molded temperature:
Melting temperature:
Medium to high stiffness

SILICON
Elastic module:
Molded temperature:
Melting temperature:
Medium to high stiffness

TPE
Elasticity: 300%–600%;Processing temperature: 180°C–250°C (356°F–482°F);Fatigue tesistance: 100,000–500,000 cycles;UV resistance: ModerateTensile strength: 5–50 MPa.

STANDARD HIGH-RES PHOTORESIN
Elastic module:
Melting temperature:
Refractive index at 589 nm:
Medium to high stiffness

We can choose trasparent or non-trasparent materials.

STANDARD HIGH-RES PHOTORESIN
Elastic module:
Melting temperature:
Refractive index at 589 nm:
Medium to high stiffness

We can choose trasparent or non-trasparent materials.