


MICRO-CONNECTOR
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Material: high-resolution photo-resin.
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Achievable tolerances below 2 µm;
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Customizable pin spacing (<0.4mm);
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High aspect ratio to garantee structural integrity;
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Feature size below 5 µm
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Production time in 2 weeks.
MICRO-GEAR
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Material: PEEK
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Achievable tolerances below 2 µm;
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Customizable pin spacing (<0.4mm);
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High aspect ratio to garantee structural integrity;
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Feature size below 5 µm
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Production time in 2 weeks.
MOLDED PART
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Material: high-resolution photo-resin.
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Achievable tolerances below 2 µm;
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Customizable pin spacing (<0.4mm);
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High aspect ratio to garantee structural integrity;
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Feature size below 5 µm
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Production time in 2 weeks.

MICRO-ARRAY
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Material: high-resolution photo-resin.
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Achievable tolerances below 2 µm;
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Customizable pin spacing (<0.4mm);
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High aspect ratio to garantee structural integrity;
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Feature size below 5 µm
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Production time in 2 weeks.

MICRO-ENDOSCOPE
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Material: high-resolution photo-resin.
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Achievable tolerances below 2 µm;
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Customizable pin spacing (<0.4mm);
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High aspect ratio to garantee structural integrity;
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Feature size below 5 µm
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Production time in 2 weeks.

MICROFLUIDICS CHIP
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Material: epoxy.
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Achievable tolerances below 2 µm;
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Customizable pin spacing (<0.4mm);
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High aspect ratio to garantee structural integrity;
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Feature size below 5 µm
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Production time in 2 weeks.

MICRO-CONNECTOR
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Material: high-resolution photo-resin.
-
Achievable tolerances below 2 µm;
-
Customizable pin spacing (<0.4mm);
-
High aspect ratio to garantee structural integrity;
-
Feature size below 5 µm
-
Production time in 2 weeks.

CIRCOLAR GEOMETRIES
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Material: high-resolution photo-resin.
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Achievable tolerances below 2 µm;
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Customizable pin spacing (<0.4mm);
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High aspect ratio to garantee structural integrity;
-
Feature size below 5 µm
-
Production time in 2 weeks.

MICRO-ARRAY
-
Material: high-resolution photo-resin.
-
Achievable tolerances below 2 µm;
-
Customizable pin spacing (<0.4mm);
-
High aspect ratio to garantee structural integrity;
-
Feature size below 5 µm
-
Production time in 2 weeks.