VERA™:
True 3D microfabrication beyond lithography
Our micromanufacturing capabilities integrate the proprietary VERA™ process with advanced electroforming technologies to enable the realization of fully three-dimensional microstructures with highly complex geometries. The process platform supports the fabrication of microparts across different material classes, including metals, while maintaining the precision, repeatability and scalability required for industrial production..
Technical capabilities
A hybrid process connecting micro-precision with mass production
Vera combines ultra-high resolution of two-photon polymerization (2PP) with advanced replication technologies and industrial mass-production techniques.
The result: true 3D microstructures with lithography level precision produced and ready in 2 weeks.
1. 2PP VOXEL MASTERING
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Rapid design iterations
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3D design freedom
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Custom feature-specific drafts > 0°
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Cornering radii below 1 µm
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Precision across every axis
2. TOOL REPLICATION
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Fastest lead times in the industry
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Both soft and hard tools
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Full in-house capabilities
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Reliable replication
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Materials like Nickel, PDMS, Ceramic..
3. FINAL PRODUCTION
For the transition to mass production, micromolding and hot embossing technologies enable the efficient replication of high-precision microstructures at industrial scale. Supporting wafer sizes up to 6 inches, these processes ensure large-area production while maintaining excellent structural fidelity and repeatability. The ability to create high-resolution microstructures makes them ideal for medical and analytical devices, while the flexibility to select the most suitable material allows optimization of performance and functionality. This scalable approach provides a reliable path from master replication to high-volume manufacturing, delivering consistent quality and cost-effective production of advanced microdevices.
3D Metal Microparts and Tools
Electroforming technologies such as UV-LIGA have enabled high-precision metal microparts for decades. However, they remain fundamentally constrained by 2D mask-based geometries, vertical sidewalls, and limited thickness.
NanoVoxel overcomes these limitations.
For the first time, electroforming is extended into a true three-dimensional manufacturing capability, enabling freeform metal microparts with micron-level precision and significantly increased structural depth.
